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Would you like to play a major role in the development of the new ITS and to work on construction of the Inner Barrel modules? Would you like to be part of the EP Departmental Silicon Facility and work in close collaboration with the facility team? Then join the ALICE Detector Group.
As a Wire Bonding Technician in the EP-AID-DT Section, you will be in charge of the wire-bonding of a large number of ITS detector modules. This will include programming, set-up, operation and fine-tuning of wire bonding equipment.
- Prepare components to be used in the assembly of hybrid microcircuits and sub-assemblies, including cleaning with ultrasonic baths and similar methods and visual inspection.
- Assemble or modify tasks on hybrid microcircuits and sub-assemblies, including wire bonding under conditions such as small pad sizes, ultrathin silicon dies, unusual substrate configurations that require special setup and bonding techniques.
Publisert 27. mars
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